Texas Instruments (TI) has expanded its supply agreement with GE Appliances, more than doubling chip procurement for the next‑generation smart laundry line. The new products – including the Profile series ventless heat‑pump washer‑dryer combo – are set to roll out in 2027 from a new Louisville, Kentucky, plant.
Under the deal, TI’s microcontrollers, Wi‑Fi connectivity solutions, and analog ICs will account for about one‑third of total chip content in the new machines – nearly double the previous share. The collaboration focuses on wireless connectivity, power management, motor control, and AI‑ready software features, all while keeping the appliance exterior unchanged.
Key upgrades include:
GaN‑based motor drivers for quieter, more efficient drain pump operation and reduced board space.
Next‑gen Wi‑Fi + BLE for enhanced security and remote management.
Advanced power conversion ICs for improved energy efficiency and diagnostics.
GE Appliances is also evaluating TI’s new intelligent MCU platform for future models, targeting predictive maintenance, adaptive washing, and centralized appliance control.
All TI chips will come from its US fabs in Utah (Lehi) and Texas (Richardson, Sherman), aligning with GE’s push to increase local sourcing for critical components.
ICgoodFind Takeaway:
This long‑term order confirms analog and power chips are central to appliance intelligence. GaN drivers are finding real traction in home appliances – a trend worth tracking.
