UTC (Universal Scientific Industrial) Semiconductor Products on ICGOODFIND SiteMap
最新文章
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Preface
- Quantinuum Upsized IPO to $1.46B, Valuation Hits $14.3B on Strong Demand
- Intel Debuts 18A Xeon 6+, E835 Ethernet, and Xe3P GPU at Taipei Show
- Maxio’s First UFS 3.1 Controller Ships to Major China Customers, PCIe 5.0 Enterprise SSD Controller in Test
- TrendForce Raises 2027 Memory Market Forecast to $1.28T, Driven by Agentic AI
- Loongson Plans $317M Private Placement, LoongArch CPU Shipments Top 1 Million
- Kioxia Delays BiCS10 3D NAND Mass Production to 2027, Boosts Density 59%
- NXP 74HC377PW: Octal D-Type Flip-Flop with Data Enable Logic IC
- NXP 74LVTH244APW: 3V Octal Buffer/Line Driver with 3-State Outputs and Bus-Hold
- NXP FS32R274KBK2MMM: A Comprehensive Technical Overview of the High-Performance Automotive Radar Microcontroller
- The NXP BFG540W is a silicon germanium carbon (SiGe:C) RF bipolar junction transistor (BJT) engineered for ultra-low noise and high gain performance in wireless applications. This N-channel enhancemen
- NXP LPC1751FBD80K: A Comprehensive Technical Overview of the ARM Cortex-M3 Microcontroller
- NXP BLP7G22-10: A High-Performance 5 GHz Base Station LDMOS Power Transistor for 4G and 5G Infrastructure
- NXP 74ABT541PW Octal Buffer/Line Driver with 3-State Outputs: Features and Application Overview
- NXP BUK7J1R4-40H: A High-Performance 40V MOSFET for Advanced Automotive and Industrial Applications
- Panasonic, Kemet Raise Capacitor Prices Up to 65% as AI Server Demand Tightens Supply
- Russia Turns to Chinese AI Chips for GigaChat as Western Sanctions Bite
- Ex-Samsung Exec Predicts Memory Chip Prices to Drop in H2 2027 as China Ramps Capacity
- Anlogic Launches ELF5 and Phoenix 1P FPGAs, Shifts from Local Substitute to Industry Leader
- Xiaomi Confirms New Xuanjie Chip in 2026, First Gen Surpassed 1M Shipments
- NXP LPC1517JBD48: A 32-bit ARM Cortex-M3 Microcontroller for Industrial and IoT Applications
- The NXP FS32K118LATOMLFT is a member of the FS32K1xx family of 32-bit Arm® Cortex®-M4F-based microcontrollers, specifically engineered for the demanding requirements of the automotive industry. This p
- NXP 2PA1576S: A Comprehensive Overview of Key Features and Applications
- NXP CLRC663: A Comprehensive Guide to High-Performance NFC Reader ICs
- The NXP FS32K142HFTOVLHT is a member of the S32K1xx family of 32-bit Arm® Cortex®-M4F-based microcontrollers, specifically engineered for the demanding requirements of the automotive industry. This pa
- i.MX 6UltraLite: Powering the Next Generation of Efficient Embedded Systems with the MCIMX6Y0DVM05AA
- Apple Taps Intel’s 18A-P for A/M Series Chips, Ending TSMC’s Exclusive Grip
- NXP LPC11U68JBD48E: A Comprehensive Technical Overview of the ARM Cortex-M0+ Microcontroller
- MCIMX356AJQ5CR2: A Technical Overview of NXP's i.MX RT Crossover Processor
- Microchip Launches LAN878x/LAN888x Single-Pair Ethernet PHYs with MACsec for Automotive and Industrial Use
- SG Micro Launches SGM51633S2: 16-Bit SAR ADC with 333ns Delay and 93dB SNR
- indie Semiconductor Buys ams OSRAM’s CIS Business for €40M
- NXP BZX84-A75: A Comprehensive Technical Overview of the 8V Zener Diode
- NXP P82B96DPZ: Extending I²C Communication Range and Enabling Bus Translation
- NXP TJA1055T/CM: A High-Performance Standalone CAN FD Transceiver for Robust Network Nodes
- NXP SPC5605BK0MLL6R 32-bit Microcontroller for Automotive Body Control Applications
- NXP PMBFJ112: High-Performance JFET for Low-Noise Amplification and Switching Applications
- NXP TJA1055T/3/2: A High-Performance CAN Transceiver for Robust Automotive Networking
- NXP TEA1716: A High-Performance Resonant Half-Bridge Combo Controller for Advanced Power Supply Designs
- NXP SPC5604PFLQ6R 32-Bit Microcontroller for Automotive Body Control Applications
- Global Semiconductor Packaging Market to Hit $618.9B, Fueled by AI and EVs
- World’s Largest MEMS Foundry Silex Lists on Nasdaq Stockholm
- Arm Q4 Revenue Hits $1.49B Record – AI Drives Royalty Surge
- AMD Q1 Net Profit Jumps 95% – Samsung Breaks $1 Trillion Market Cap
- The NXP HEF4040BT: A Comprehensive Guide to the 12-Stage Binary Ripple Counter
- NXP MMPF0100NPAZES: A Comprehensive Power Management IC for Advanced Applications
- NXP 74LVC1G00GW,125: A Single 2-Input NAND Gate in a Miniature Package for Modern Space-Constrained Designs
- NXP IP4284CZ10-TBR: Advanced ESD Protection for High-Speed Data Interfaces
- NXP 74HC4051D: A Comprehensive Guide to the High-Speed CMOS Analog Multiplexer/Demultiplexer
- NXP S9KEAZ128AMLK: A Comprehensive Technical Overview of the ARM Cortex-M0+ Based Microcontroller
- NXP 74AHCT541PW: 3V to 5V Octal Buffer/Line Driver with 3-State Outputs
- NXP PCA9675PW: A Comprehensive Guide to the 16-bit I²C-bus and SMBus I/O Expander
- Renesas Q1 Operating Profit Soars 49.6% – Data Center & Auto Drive Beat
- NXP PMEG4030ER: A Comprehensive Technical Overview of its Low VF Schottky Barrier Diode Characteristics
- NXP LPC1788FBD144: A High-Performance ARM Cortex-M3 Microcontroller for Embedded Systems
- NXP TJA1044GT/3: A High-Performance CAN Transceiver for Robust Automotive Networking
- PCF8566T/1,118: NXP's Low-Power I2C LCD Driver for Embedded Systems
- NXP 74HCT2G34GW: A Dual Non-Inverting Buffer Gate for Modern Digital Logic Applications
- NXP TDA8920CTH: A Comprehensive Overview of the 2x50W Class-D Audio Amplifier
- NXP KTY81/120 Silicon Temperature Sensors: Precision, Performance, and Application
- The NXP BLF861A is a high-performance N-channel enhancement-mode lateral MOSFET (LDMOS) transistor designed for RF power amplification in the 860-960 MHz frequency band. Engineered for robust operatio
- Xiaomi XRING O3 Chip Leak – 4GHz+ Prime Core and Full Architecture Overhaul
- Tokyo Electron Cuts Ties with China Chief Over Secret Startup Ties
- Bosch Launches 3rd‑Gen SiC Chip – 20% Performance Leap for EVs
- Japan 7.7 Magnitude Earthquake Hits Semiconductor Hub – Kioxia & Tokyo Electron Report No Damage
- Diodes AL8859Q – Automotive SPI Boost Controller for Headlight Systems
- UMC and eMemory Restart Memory Foundry in Japan – 2D NAND & NOR Flash
- Huawei Launches Kirin 9030S with 200% AI Performance Surge – Pura 90 Series First
- Chinese Semi Equipment Leader ACM Research Plans Hong Kong Listing
- Yuanjie Technology Tops 1,410 Yuan, Dethrones Moutai as A-Share “Stock King”
- ASE Invests $443M to Acquire Innolux Fab – Advanced Packaging Capacity Surges
- China IC Exports Soar 84.9% in March – Semiconductor Shipments Accelerate
- Chang Guang Chenxin Leads Global High-End CMOS, Launches Hong Kong IPO
- Japan Drops ¥2.35T on Rapidus to Break TSMC’s Lead
- Complete Guide to Electronic Component Letter Symbols (Detailed Explanation by ICGOODFIND)
- Goke Micro Breaks Into Auto MCU with 3 Series
- 5 Hot Domestic MCU Series Cover Every Application Need
- ICGOODFIND Talks About China's Automotive Chip Market Sales Ranking in March 2026
- 800V Power Surge Pushes GaN Ahead of SiC
- Title: SMIC Launches New Semiconductor Subsidiary in Strategic Expansion
- Carlyle Acquires OMRON DMB for 81 Billion Yen
- DRAM Prices Crash as Panic Selling Hits Memory Market
- AMEC Unveils Four New Semiconductor Tools at SEMICON China
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- Cisco’s 102.4T Silicon One G300 Reshapes AI Networking
- US Presses TSMC to Shift 40% of Capacity Stateside
- Micron Q2 Net Profit Soars 770%: DRAM Up 65%, NAND Up 80%
- AOS Launches 25V/80V MOSFETs for AI Server Power
- Yield Over 90%! This Chipmaker's SiC Platform Goes Live
- Innoscience GaN Products Cleared for U.S. Market Entry
- India Plans $10.8B Fund to Boost Domestic Chip Industry
- JCET Launches New Shanghai Plant for Automotive Chip Packaging
- WIZNET Full Series Chips (W5100/W5200/W5300/W5500/W7500P/W5100S-L/W5100S-Q/W6100-L) | Source Now at ICgoodFind
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